The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2014
Filed:
Mar. 13, 2013
Applicant:
Unistars Corporation, Hsinchu, TW;
Inventors:
Tien-Hao Huang, Zhongli, TW;
Hsin-Hsie Lee, Taoyuan County, TW;
Yi-Chun Wu, Miaoli County, TW;
Shang-Yi Wu, Hsinchu, TW;
Assignee:
Unistars Corporation, Hsinchu County, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 21/4763 (2006.01); B32B 7/12 (2006.01); H01L 33/00 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
B32B 7/12 (2013.01); H01L 33/005 (2013.01); H01L 33/48 (2013.01);
Abstract
A substrate includes a die-bonding zone and a glue spreading pattern. The die-bonding zone is set to bond a die. The glue spreading pattern is placed in the die-bonding zone and includes a containing space. The die is placed on the glue spreading pattern, an area of a bottom of the die is greater than an area of an opening of the glue spreading pattern, the containing room of the glue spreading pattern is filled with a glue, and the die is bonded to the substrate by means of the glue.