Hsin-Chen Tsai

Title: Hsin-Chen Tsai: Innovator in Interconnect Structures

Introduction

Hsin-Chen Tsai is an inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of interconnect structures, focusing on methods to improve their performance. His innovative approach aims to enhance the efficiency of interconnects used in various electronic applications.

Latest Patent Applications

Hsin-Chen Tsai has filed a patent application titled "Interconnect Structure and Method for Forming Interconnect Structure." This application discloses an improved interconnect structure and a method for forming it, which allows the interconnect structure to achieve a lower Rc. To lower the Rc of the interconnect structure, an α-phase inducing metal layer is introduced on a first Ta barrier layer of β phase. This process induces the subsequent deposition of Ta, leading to the formation of an α-phase Ta barrier layer. The subsequently deposited Ta barrier layer, with a primary crystallographic structure of α phase, exhibits a lower Rc than that of the β-phase Ta barrier layer.

Conclusion

Hsin-Chen Tsai's work in developing advanced interconnect structures showcases his innovative spirit and dedication to improving electronic technologies. His contributions are poised to have a lasting impact on the field.