Taoyuan, Taiwan

Hsien-Yeh Chen

This inventor holds 1 USPTO granted patent. Top assignee: Tripod Technology Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hsien-Yeh Chen. Retrieved from https://idiyas.com/inventor/hsien-yeh-chen-wr26l5vv

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Hsien-Yeh Chen: Inventor of a Film-Formation Method.

Introduction

Hsien-Yeh Chen is an inventor based in Taoyuan, Taiwan. He is associated with Tripod Technology Corporation and is named on 1 patent.

Latest Patents

Chen’s patent, “Method for Forming Film,” describes a process for depositing a polymer layer on a workpiece. The method first controls the workpiece temperature so a gaseous sacrificial material desublimates onto its surface, forming a solid layer. The chamber pressure and workpiece temperature are then adjusted to make that layer gradually sublime. Reactive polymer monomers are introduced and adsorb onto the sacrificial layer, initiating polymerization as the sacrificial material continues to sublime. Once it has fully sublimated, a polymer layer remains deposited on the workpiece surface.

Career Highlights

Chen’s listed invention focuses on a film-formation technique that combines sacrificial-material sublimation with monomer adsorption and polymerization. His company affiliation is Tripod Technology Corporation.

Collaborations

Chen’s listed coworkers include Yu-Ming Chang and Yun-Shan Wang.

Conclusion

Hsien-Yeh Chen’s patent presents a film-forming process that uses a sublimating sacrificial layer to support polymer deposition on a workpiece.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…