Hsien-Lung Hsiao

Title: Hsien-Lung Hsiao: Innovator in Electronic Packaging

Introduction

Hsien-Lung Hsiao is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 5 patents. His innovative methods have advanced the technology used in electronic components, ensuring better performance and reliability.

Latest Patents

Hsien-Lung Hsiao's latest patents include a method for fabricating electronic packages. This method involves disposing an electronic component on a substrate, forming an encapsulant layer on the substrate to encapsulate the electronic component, and creating a shielding layer made of metal on the encapsulant layer. The shielding layer features an extending portion that reaches the lateral side of the substrate along the corner of the encapsulant layer, without extending to the lower side of the substrate. This design prevents the shielding layer from contacting conductive pads on the lower side of the substrate, thereby avoiding potential short circuits.

Career Highlights

Hsien-Lung Hsiao is associated with Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor packaging industry. His work has been instrumental in developing advanced electronic packaging solutions that enhance the functionality and durability of electronic devices.

Collaborations

Hsien-Lung Hsiao has collaborated with notable colleagues, including Shu-Chi Chang and Kaun-I Cheng. Their combined expertise has contributed to the successful development of innovative electronic packaging technologies.

Conclusion

Hsien-Lung Hsiao's contributions to electronic packaging through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the advancement of technology in electronic components.