This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2023
Title: Hsiao-Yen Lee: Innovator in Semiconductor Packaging
Introduction
Hsiao-Yen Lee is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His work focuses on innovative structures and methods that enhance the performance and reliability of semiconductor devices.
Latest Patents
Hsiao-Yen Lee's latest patents include advancements in semiconductor package structures and methods of manufacturing them. One of his notable inventions describes a semiconductor package structure that consists of a substrate, a die, and a conductive structure. In this design, the die is positioned on or within the substrate, featuring a sensing region and a pad on its first surface. The arrangement ensures that the distance from the sensing region to the pad is optimized for effective functionality.
Another patent outlines a semiconductor package structure that incorporates a first electronic component, a conductive element, and a first redistribution structure. This invention emphasizes the importance of coplanarity between the conductive element and the first conductive via of the electronic component, facilitating efficient electrical connections.
Career Highlights
Hsiao-Yen Lee is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor technology. His expertise in semiconductor packaging has positioned him as a key player in the industry, contributing to advancements that benefit various electronic applications.
Collaborations
Hsiao-Yen Lee has collaborated with notable colleagues, including Ying-Te Ou and Chin-Cheng Kuo. These partnerships have fostered a collaborative environment that enhances the development of cutting-edge semiconductor technologies.
Conclusion
Hsiao-Yen Lee's contributions to semiconductor packaging through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to shape the future of semiconductor technology, ensuring improved performance and reliability in electronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile