This inventor holds 1 USPTO granted patent. Top assignee: Advanced Chip Engineering Technology, Inc.. Active years: 2009.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2009
Title: Hsi-Ying Yuan: Innovator in Wafer Level Packaging Technology
Introduction
Hsi-Ying Yuan is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly in wafer level packaging technology. His innovative approach has led to advancements that enhance the efficiency and effectiveness of electronic components.
Latest Patents
Hsi-Ying Yuan holds a patent for a "Method for forming filling paste structure of WL package." This patent describes a process that involves filling an adhesive material among a plurality of dice to create a filling paste structure. The process ensures that the dice are adhered to a glue pattern formed on a removable substrate, which is crucial for the integrity of the wafer level package.
Career Highlights
Yuan is currently employed at Advanced Chip Engineering Technology, Inc., where he continues to develop cutting-edge technologies in semiconductor packaging. His work has been instrumental in improving the reliability and performance of electronic devices.
Collaborations
Hsi-Ying Yuan collaborates with talented professionals in his field, including Chun Hui Yu and Wen-Kun Yang. These partnerships foster innovation and drive advancements in technology.
Conclusion
Hsi-Ying Yuan's contributions to wafer level packaging technology exemplify his commitment to innovation in the semiconductor industry. His patent and ongoing work at Advanced Chip Engineering Technology, Inc. highlight his role as a key figure in this evolving field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile