Essex Junction, VT, United States of America

Howard S Landis

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Globalfoundries U.S. Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Howard S Landis. Retrieved from https://idiyas.com/inventor/howard-s-landis

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Howard S. Landis: Innovator in Wafer-Scale Chip Design

Introduction

Howard S. Landis is a notable inventor based in Essex Junction, Vermont, known for his contributions to semiconductor technology. He has made significant strides in the field of wafer-scale chip structures, which are crucial for enhancing the performance and efficiency of semiconductor devices. His innovative approach has led to the development of a unique patent that addresses key challenges in chip design.

Latest Patents

Howard S. Landis holds a patent for a wafer-scale chip structure and method and system for designing the structure. This patent discloses a wafer-scale chip structure that includes a semiconductor wafer and multiple dies on the wafer. The design incorporates at least two dies with different patterns of fill shapes. The patent also outlines wafer-scale chip design methods and systems that perform post-chip layout wafer-level topography optimization. This optimization aims to minimize performance variations between dies of the same design within the wafer-scale chip. The design methods utilize across-wafer die placement and wafer-level topography information to custom design and select different patterns of fill shapes, ensuring a design that minimizes thickness variations across the wafer.

Career Highlights

Howard S. Landis is currently associated with GlobalFoundries U.S. Inc., a leading semiconductor manufacturer. His work at GlobalFoundries has positioned him as a key player in advancing semiconductor technology. With a focus on innovative chip design, Landis has contributed to the development of efficient and high-performance semiconductor solutions.

Collaborations

Throughout his career, Howard has collaborated with talented professionals in the field, including Osamu Samuel Nakagawa and Ushasree Katakamsetty. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Howard S. Landis is a distinguished inventor whose work in wafer-scale chip design has made a significant impact on the semiconductor industry. His innovative patent and contributions to GlobalFoundries U.S. Inc. highlight his commitment to advancing technology in this critical field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…