This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Globalfoundries U.S. Inc.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Howard S. Landis: Innovator in Wafer-Scale Chip Design
Introduction
Howard S. Landis is a notable inventor based in Essex Junction, Vermont, known for his contributions to semiconductor technology. He has made significant strides in the field of wafer-scale chip structures, which are crucial for enhancing the performance and efficiency of semiconductor devices. His innovative approach has led to the development of a unique patent that addresses key challenges in chip design.
Latest Patents
Howard S. Landis holds a patent for a wafer-scale chip structure and method and system for designing the structure. This patent discloses a wafer-scale chip structure that includes a semiconductor wafer and multiple dies on the wafer. The design incorporates at least two dies with different patterns of fill shapes. The patent also outlines wafer-scale chip design methods and systems that perform post-chip layout wafer-level topography optimization. This optimization aims to minimize performance variations between dies of the same design within the wafer-scale chip. The design methods utilize across-wafer die placement and wafer-level topography information to custom design and select different patterns of fill shapes, ensuring a design that minimizes thickness variations across the wafer.
Career Highlights
Howard S. Landis is currently associated with GlobalFoundries U.S. Inc., a leading semiconductor manufacturer. His work at GlobalFoundries has positioned him as a key player in advancing semiconductor technology. With a focus on innovative chip design, Landis has contributed to the development of efficient and high-performance semiconductor solutions.
Collaborations
Throughout his career, Howard has collaborated with talented professionals in the field, including Osamu Samuel Nakagawa and Ushasree Katakamsetty. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Howard S. Landis is a distinguished inventor whose work in wafer-scale chip design has made a significant impact on the semiconductor industry. His innovative patent and contributions to GlobalFoundries U.S. Inc. highlight his commitment to advancing technology in this critical field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile