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For the Inventor, By the Inventor

Endicott, NY, United States of America

Howard L Heck

This inventor holds 5 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 1994-1997.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Howard L Heck. Retrieved from https://idiyas.com/inventor/howard-l-heck-wsiptbgu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5

% Patents Active = 100.0

Average Co-Inventor Count = 4.1

ph-index = 4

Forward Citations = 117(Granted Patents)


Location History:

  • Endicott, NY (US) (1994)
  • Endcott, NY (US) (1995 - 1997)

Company Filing History:

goldMedal5 out of 166,351 
 
International Business Machines Corporation
 patents

Years Active: 1994-1997

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5 patents (USPTO):Explore Patents
1. 5620782 - Method of fabricating a flex laminate package (1997-04-15),
2. 5509196 - Method of fabricating a flex laminate package (1996-04-23),
3. 5384690 - Flex laminate package for a parallel processor (1995-01-24),
4. 5347710 - Parallel processor and method of fabrication (1994-09-20),
5. 5301118 - Monte carlo simulation design methodology (1994-04-05),

Title: The Innovations of Howard L Heck

Introduction

Howard L Heck is a notable inventor based in Endicott, NY (US). He has made significant contributions to the field of technology, particularly in the area of flexible laminate packaging. With a total of 5 patents to his name, his work has had a lasting impact on the industry.

Latest Patents

One of Howard L Heck's latest patents is a method of fabricating a flex laminate package. This invention discloses a parallel processor packaging structure and a method for manufacturing the structure. The individual logic and memory elements are placed on printed circuit cards, which are then mounted on or connected to circuitized flexible substrates. These substrates extend outwardly from a laminate of the circuitized, flexible substrates. Intercommunication is facilitated through a switch structure implemented in the laminate. The design allows for XY plane and Z-axis interconnections for various types of communication, including inter-processor and inter-memory connections. The lamination process utilizes a low melting adhesive that is chemically compatible with the materials involved, ensuring effective adhesion in designated areas while avoiding unwanted lamination in others.

Career Highlights

Howard L Heck has had a distinguished career, primarily working with International Business Machines Corporation (IBM). His innovative approaches and technical expertise have contributed to advancements in flexible packaging technologies. His work has not only enhanced product performance but has also paved the way for future innovations in the field.

Collaborations

Throughout his career, Howard has collaborated with several talented individuals, including John Steven Kresge and Thomas P Duffy. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

In summary, Howard L Heck is a prominent inventor whose work in flexible laminate packaging has significantly influenced the technology sector. His patents and collaborations reflect his commitment to innovation and excellence in engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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