Guangdong, China

Houyong Luo

This inventor holds 1 USPTO granted patent. Top assignee: Dongguan D-Tek Technology Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Houyong Luo. Retrieved from https://idiyas.com/inventor/houyong-luo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Houyong Luo

Introduction

Houyong Luo is a notable inventor based in Guangdong, China. He has made significant contributions to the field of technology, particularly in the area of solder ball implantation. His innovative approach has led to the development of a unique device that enhances the efficiency and accuracy of solder ball placement in electronic components.

Latest Patents

Luo holds a patent for the "Single-head tin ball implantation spray head." This invention features a spray head body that includes a longitudinal blanking channel and a feeding channel. The design allows for the precise control of solder balls, enabling them to move quickly and be implanted accurately on circuit boards, wafers, or chips. The device is capable of handling solder balls with a particle size of more than 0.06 mm, ensuring high efficiency, yield, and accuracy in the ball implantation process.

Career Highlights

Houyong Luo is associated with Dongguan D-Tek Technology Co., Ltd., where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of solder ball implantation, making it more efficient and cost-effective.

Collaborations

Luo collaborates with Peng Wu, a coworker who shares his passion for innovation and technology. Together, they work on projects that aim to improve the manufacturing processes in the electronics industry.

Conclusion

Houyong Luo's contributions to the field of technology, particularly through his patented invention, demonstrate his commitment to innovation and excellence. His work not only enhances the efficiency of electronic component manufacturing but also sets a standard for future developments in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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