Single-head tin ball implantation spray head

Abstract

The invention discloses a single-headed tin ball implantation spray head, which comprises a spray head body, wherein a longitudinal blanking channel and a feeding channel communicated with the longitudinal blanking channel are respectively formed in the spray head body, and a feeding channel communicated with the feeding channel is formed on the spray head body; A blanking control mechanism is arranged on the main body of the spray head, and the blanking control mechanism corresponds to the position where the feed channel is communicated with the longitudinal blanking channel. The single-head solder ball implantation spray head can control the solder balls to move quickly in the spray head body and spray out from the nozzle one by one in an orderly manner, can accurately implant the solder balls on the surface of a circuit board, a wafer or a chip, can accurately control the solder balls with a particle size of more than 0.06 mm for ball implantation, and has high ball implantation efficiency, yield and accuracy, and is suitable for ball implantation of components with various shapes, models and sizes, with low processing cost and good operation stability.