Company Filing History:
Years Active: 2019-2025
Title: Horst Brüggmann: Innovator in High Density Interconnect Technology
Introduction
Horst Brüggmann is a notable inventor based in Berlin, Germany. He has made significant contributions to the field of printed circuit board technology, particularly in high density interconnect (HDI) systems. With a total of 5 patents to his name, Brüggmann's work has advanced the capabilities of electronic components.
Latest Patents
One of Brüggmann's latest patents is a method of preparing a high density interconnect printed circuit board that includes microvias filled with copper. This invention focuses on the preparation of HDI PCBs or integrated circuit substrates that feature through-holes and grate structures filled with copper. The method outlines specific steps to enhance the manufacturing process and improve the performance of electronic devices.
Career Highlights
Throughout his career, Horst Brüggmann has worked with prominent companies in the electronics industry. He has been associated with Atotech Deutschland GmbH & Co. KG and Atotech Deutschland GmbH, where he has contributed to various innovative projects. His expertise in HDI technology has positioned him as a key player in the development of advanced circuit board solutions.
Collaborations
Brüggmann has collaborated with several professionals in his field, including Thomas Schiwon and Bert Reents. These partnerships have fostered a creative environment that has led to the development of cutting-edge technologies in printed circuit board manufacturing.
Conclusion
Horst Brüggmann's contributions to the field of high density interconnect technology have made a lasting impact on the electronics industry. His innovative patents and collaborations with industry professionals highlight his commitment to advancing technology. His work continues to influence the design and manufacturing of electronic components.