Hooi Jin Teng

Title: Innovations by Hooi Jin Teng

Introduction

Hooi Jin Teng is an accomplished inventor based in Penang, Malaysia. He has made significant contributions to the field of packaging technology. His innovative approach has led to the development of a unique method for controlling package warpage.

Latest Patents

Hooi Jin Teng holds a patent for a method of packaging that includes placing a restrainer on a package during processing. This method involves clipping the restrainer in place and exposing the package to high temperatures. After processing, the restrainer is removed. An alternative process he developed attaches a component die to a substrate with a cavity on its first surface. This process includes dispensing and curing an underfill material in the cavity, followed by attaching a lid to the first surface of the substrate. He has 1 patent to his name.

Career Highlights

Hooi Jin Teng is currently employed at Intel Corporation, where he continues to innovate and contribute to advancements in technology. His work has been instrumental in improving packaging methods, which are crucial for the integrity of electronic components.

Collaborations

Hooi Jin Teng has collaborated with notable colleagues, including Michael Keat Lye Lee and Mun Leong Loke, who is a talented woman in the field. Their teamwork has fostered an environment of creativity and innovation.

Conclusion

Hooi Jin Teng's contributions to packaging technology exemplify the spirit of innovation. His patent for package warpage control showcases his ability to solve complex problems in the industry. His work at Intel Corporation and collaborations with esteemed colleagues further highlight his impact on the field.