Victor, NY, United States of America

Hongyi Mi

USPTO Granted Patents = 5 


Average Co-Inventor Count = 3.5

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2021-2025

where 'Filed Patents' based on already Granted Patents

5 patents (USPTO):

Title: The Innovations of Hongyi Mi

Introduction

Hongyi Mi is a prominent inventor based in Victor, NY (US). He has made significant contributions to the field of imaging technology, holding a total of 5 patents. His work focuses on advancing solid-state imaging devices and enhancing the functionality of imaging sensors.

Latest Patents

Among his latest patents are two notable inventions. The first is a solid-state imaging device that features a plurality of unit pixels organized into pixel groups, which are separated by isolation structures. This design allows unit pixels within each group to share circuit elements while maintaining separation through full thickness isolation structures. Additionally, some isolation structures between unit pixels are designed as deep trench isolation structures. The second patent involves binning in a hybrid pixel structure that includes both image pixels and event vision sensor (EVS) pixels. This innovative imaging sensor comprises a pixel array with multiple pixel circuits and binning transistors, allowing for enhanced functionality and efficiency.

Career Highlights

Hongyi Mi is currently employed at Sony Semiconductor Solutions Corporation, where he continues to push the boundaries of imaging technology. His work has been instrumental in developing advanced imaging solutions that cater to various applications.

Collaborations

He has collaborated with notable colleagues, including Frederick T Brady and Pooria Mostafalu, contributing to a dynamic and innovative work environment.

Conclusion

Hongyi Mi's contributions to imaging technology through his patents and collaborations highlight his role as a leading inventor in the field. His work continues to influence advancements in imaging devices and sensors.

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