Company Filing History:
Years Active: 2023-2025
Title: Innovations of Hongwon Kim in Semiconductor Packaging
Introduction
Hongwon Kim is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding 2 patents that showcase his innovative approach to technology.
Latest Patents
His latest patents include a semiconductor package that features a base substrate, an interposer package, and first and second semiconductor chips. The interposer package is equipped with a first redistribution layer, a bridge chip with a bridge circuit, and a vertical connection structure comprising multiple wiring layers. Each semiconductor chip is electrically connected to the bridge circuit and wiring layers through the first redistribution layer. Another notable patent involves a semiconductor package that includes a redistribution substrate with a first insulating layer and several second insulating layers. The first insulating layer is made of a photosensitive resin with an elongation of 60% or more and toughness of 70 mJ/mm or more. The second insulating layers consist of a photosensitive resin with an elongation ranging from 10% to 40% and toughness of 40 mJ/mm.
Career Highlights
Hongwon Kim is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing the efficiency and performance of semiconductor packages.
Collaborations
He has collaborated with notable coworkers, including Doohwan Lee and Taesung Jeong, contributing to a dynamic team focused on innovation in the semiconductor industry.
Conclusion
Hongwon Kim's contributions to semiconductor packaging reflect his dedication to innovation and excellence in technology. His patents not only enhance the functionality of semiconductor devices but also pave the way for future advancements in the field.