Samsung Electronics Co., Ltd.

Hongwon Kim

Doohwan Lee

Yunhee Kim

Jongkook Kim

Taesung Jeong

Junggon Choi

JeongHo Lee

Junmo Koo

Yeonjoo Kim

A semiconductor package includes a base substrate, an interposer package disposed on the base substrate, and first and second semiconductor chips disposed on the interposer package, the interposer package includes a first redistribution layer, a bridge chip including a bridge circuit, and a vertical connection structure including a plurality of wiring layers, and wherein each of the first semiconductor chip and the second semiconductor chip is electrically connected to the bridge circuit and the plurality of wiring layers through the first redistribution layer.

Semiconductor package

A semiconductor package including a redistribution substrate with a first insulating layer, one or more second insulating layers on the first insulating layer, and a plurality of redistribution layers. The first insulating layer includes a first photosensitive resin having an elongation of 60% or more and toughness of 70 mJ/mmor more. The one or more second insulating layers include a second photosensitive resin having an elongation in a range of 10% to 40% and toughness of 40 mJ/mm.

Growing community of inventors

Suwon-si, South Korea

Hongwon Kim