Shanghai, China

Hongwen Yang


Average Co-Inventor Count = 3.9

ph-index = 2

Forward Citations = 17(Granted Patents)


Company Filing History:


Years Active: 2013-2023

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12 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Hongwen Yang

Introduction

Hongwen Yang is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of connector technology, holding a total of 12 patents. His work reflects a deep understanding of engineering principles and innovative design.

Latest Patents

Among his latest patents is a connector housing assembly that features a housing defining an accommodation space with a left and right side wall. This design includes a partition member that divides the space into upper and lower insertion chambers. Additionally, a shielding member is integrated within the partition, featuring elastic contacts that press against the side walls. Another notable patent is a connector housing that includes an accommodation space defined by four walls and an insertion port. This design incorporates a first positioning groove and a first positioning tooth, which work together to prevent disengagement in a perpendicular direction.

Career Highlights

Hongwen Yang has worked with notable companies such as Tyco Electronics (Shanghai) Co., Ltd. and Tyco Electronics (Zhuhai) Ltd. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Throughout his career, Hongwen has collaborated with talented individuals, including Jian Zhou and Hongqiang Han. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Hongwen Yang's contributions to connector technology exemplify his innovative spirit and dedication to engineering. His patents and collaborations highlight his role as a key figure in the advancement of this field.

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