Company Filing History:
Years Active: 2021-2025
Title: Innovations of Hongsheng Yi in Semiconductor Technology
Introduction
Hongsheng Yi is a prominent inventor based in Hubei, China, known for his significant contributions to semiconductor technology. He holds a total of four patents that showcase his expertise in wafer assembly and grinding methods. His work has been instrumental in advancing the efficiency and precision of semiconductor manufacturing processes.
Latest Patents
Hongsheng Yi's latest patents include a wafer assembly having alignment marks, a method for forming the same, and a wafer alignment method. This innovation involves alignment marks that are strategically placed in bonding layers and dielectric layers on first and second wafers. The design ensures that light reflected by specific marks on the wafers is superimposed, enhancing the clarity of the alignment patterns. Additionally, the first dot mark is positioned to ensure a macroscopically flat bonding surface, which minimizes overlay errors between different layers. Another notable patent is a grinding control method and device for wafers, which allows for the grinding of mass production wafers with updated parameters based on test wafer measurements. This innovation leads to wafers with uniform thickness and improved flatness.
Career Highlights
Hongsheng Yi is currently employed at Wuhan Xinxin Semiconductor Manufacturing Co., Ltd., where he applies his innovative ideas to real-world applications in semiconductor manufacturing. His work has not only contributed to the company's success but has also positioned him as a key figure in the industry.
Collaborations
Some of his notable coworkers include Guoliang Ye and Zhijun Zhang, who collaborate with him on various projects within the semiconductor field.
Conclusion
Hongsheng Yi's contributions to semiconductor technology through his patents and work at Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. highlight his role as an influential inventor in the industry. His innovations continue to shape the future of semiconductor manufacturing processes.