The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2025
Filed:
Sep. 28, 2020
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd., Hubei, CN;
Abstract
A wafer assembly with alignment marks, a method for forming the wafer assembly and a wafer alignment method are disclosed. The alignment marks are disposed in bonding layers and dielectric layers on first and second wafers. Light reflected by a first dot mark and a first block mark on the first wafer, which are disposed in different layers, are superimposed with each other, ensuring clarity of patterns of these alignment marks. The first dot mark is disposed in a first bonding layer in such a manner that a top surface of the first dot mark is flush with a top surface of the first bonding layer. The first dot mark located on the bonding surface ensures that the bonding surface is macroscopically flat and does not leave any gap after bonding. Moreover, the first dot mark located on the bonding surface also avoids overlay errors between different layers. The same is applied to the second wafer.