Singapore, Singapore

Hongpeng Yu


Average Co-Inventor Count = 8.0

ph-index = 2

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2017-2021

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4 patents (USPTO):Explore Patents

Title: Innovations of Inventor Hongpeng Yu in Integrated Structures

Introduction: Hongpeng Yu is a notable inventor based in Singapore, SG, with a commendable portfolio comprising four patents. His work primarily focuses on the development of integrated structures, which hold significant implications in the field of electronics and materials science.

Latest Patents: One of Hongpeng Yu's latest patents is titled "Integrated structures and methods of forming integrated structures." This invention features several embodiments, including an integrated structure characterized by a first opening that extends through a stack of alternating insulative and conductive levels. Within this first opening, a nitride structure narrows the opening to form a second opening. An innovative aspect of this patent is the inclusion of detectable oxide situated between the nitride structure and the conductive levels. Moreover, it describes an integrated structure containing a conductive material, a select device gate material over the conductive material, and vertically-stacked conductive levels. The first opening also extends through these stacked levels to the conductive material, featuring opposing sidewalls along a cross-section and nitride liners along these sidewalls, enhancing the structure's integrity and performance.

Career Highlights: Hongpeng Yu's contributions to Micron Technology Incorporated have positioned him as a leader in the development of advanced materials and structures. His expertise in integrated structures has fostered innovation within the company, enabling the creation of solutions that address complex technological challenges in the semiconductor industry.

Collaborations: Throughout his career, Hongpeng Yu has had the opportunity to work alongside talented professionals such as Jie Li and James Mathew. Their collaboration has led to significant advancements in their field, showcasing the power of teamwork in driving innovation and developing new technologies.

Conclusion: Hongpeng Yu's ongoing work and patented inventions underscore his pivotal role in the innovation landscape. His latest contributions to integrated structures not only highlight his technical expertise but also illustrate the collaborative efforts within the industry to push the boundaries of what is possible in technology.

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