San Diego, CA, United States of America

Hongjun Yao

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Qualcomm Incorporated. Active years: 2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hongjun Yao. Retrieved from https://idiyas.com/inventor/hongjun-yao-ru6w600m

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: Innovations of Hongjun Yao in Semiconductor Technology

Introduction

Hongjun Yao is a notable inventor based in San Diego, CA, who has made significant contributions to the field of semiconductor technology. He is currently associated with Qualcomm Incorporated, a leading company in wireless technology and semiconductor solutions. His innovative work has led to the development of a unique patent that enhances the testing capabilities of integrated circuits.

Latest Patents

Hongjun Yao holds a patent for a "Daisy chain connection for testing continuity in a semiconductor die." This invention describes an integrated circuit product package that is specifically configured for continuity testing. The package includes a substrate with internal routing connections and a semiconductor die that is coupled to the substrate. The semiconductor die features input/output (I/O) pins and switches that facilitate a daisy chain connection. This connection comprises circuitry fabricated on the semiconductor die, multiple internal routing connections, several I/O pins, and at least one switch, thereby improving the efficiency of testing continuity in semiconductor devices.

Career Highlights

Throughout his career, Hongjun Yao has demonstrated a strong commitment to advancing semiconductor technology. His work at Qualcomm Incorporated has positioned him as a key player in the development of innovative solutions that address the challenges faced in the semiconductor industry. His patent reflects his expertise and dedication to enhancing the functionality of integrated circuits.

Collaborations

Hongjun Yao has collaborated with several talented individuals in his field, including Michael Laisne and Matthew Michael Nowak. These collaborations have fostered an environment of innovation and creativity, contributing to the advancement of semiconductor technologies.

Conclusion

In summary, Hongjun Yao is a distinguished inventor whose contributions to semiconductor technology are noteworthy. His patent for a daisy chain connection exemplifies his innovative spirit and commitment to improving testing methods in integrated circuits. His work continues to influence the industry and pave the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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