Company Filing History:
2 out of 18,179 
2 out of 1,473 Years Active: 2017-2019
Title: Innovations of Hongjie Ding
Introduction
Hongjie Ding is a prominent inventor based in Beijing, China. He has made significant contributions to the field of technology, particularly in the development of innovative attachment apparatuses and bonding methods. With a total of 2 patents, his work showcases a blend of creativity and practicality.
Latest Patents
One of his latest patents is an "Attachment apparatus and attachment method for conductive adhesive." This invention provides a sophisticated attachment apparatus that includes a carrier stage with a working surface designed to support a printed circuit board. The working surface features a groove equipped with multiple adsorption holes, connected to a vacuum adsorption device. This mechanism is designed to attach conductive adhesive to specific regions of the printed circuit board, facilitating connections to flexible printed circuit boards or chips on film.
Another notable patent is the "Bearing platform and COF repair bonder." This invention presents a bearing platform with an adjustable size, enhancing its practicality. The design reduces the volume and weight of the COF repair bonder, making it easier to move and saving space. The bearing platform consists of a fixed part and at least one extension that can move back and forth, with supports for carrying display panels.
Career Highlights
Hongjie Ding has worked with notable companies such as BOE Technology Group Co., Ltd. and Hefei Xinsheng Optoelectronics Technology Co., Ltd. His experience in these organizations has contributed to his expertise in the field of optoelectronics and adhesive technologies.
Collaborations
Throughout his career, Hongjie has collaborated with talented individuals, including Hanwei Tu and Minghui Liu. These collaborations have likely enriched his work and led to innovative solutions in technology.
Conclusion
Hongjie Ding's contributions to the field of technology through his patents and collaborations highlight his innovative spirit and dedication to advancing the industry. His work continues to influence the development of new technologies and methods in the realm of conductive adhesives and bonding solutions.