Boe Technology Group Co., Ltd.

Hefei Xinsheng Optoelectronics Technology Co., Ltd.

Hongjie Ding

Hanwei Tu

Minghui Liu

Long Cheng

Zhiyu Qian

Pengcheng Wang

Xikui Hao

Xiangzheng Wang

Embodiments of the present invention provide an attachment apparatus and an attachment method for a conductive adhesive. The attachment apparatus includes: a carrier stage, which is provided with at least one working surface, the working surface being configured to support a printed circuit board and provided with a groove, and the groove being provided with a plurality of adsorption holes on its bottom surface; a vacuum adsorption device being connected to each of the plurality of adsorption holes; and an attaching mechanism provided above the carrier stage, and configured to attach the conductive adhesive to a predetermined region of the printed circuit board, and the predetermined region being a region of the printed circuit board to be squeeze connected to a flexible printed circuit board or a chip on film.

Attachment apparatus and attachment method for conductive adhesive

A bearing platform and a COF repair bonder are disclosed. The bearing platform has adjustable size and good practicability. Therefore, the designed volume of the COF repair bonder and its weight can be reduced, thereby saving space and being easier to move. The bearing platform includes a fixed part and at least one extension which is connected to the fixed part and can move back and forth in a first direction relative to the fixed part. Upper surfaces of the extension and the fixed part can be provided with at least one extension arm support for carrying a display panel respectively. Each extension arm support can move back and forth in a second direction relative to the fixed part, with the first direction and the second direction intersecting one another.

Bearing platform and COF repair bonder

Growing community of inventors

Beijing, China

Hongjie Ding