The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2019
Filed:
Mar. 06, 2017
Boe Technology Group Co., Ltd., Beijing, CN;
Hefei Xinsheng Optoelectronics Technology Co., Ltd., Hefei, Anhui, CN;
Hanwei Tu, Beijing, CN;
Minghui Liu, Beijing, CN;
Hongjie Ding, Beijing, CN;
Xikui Hao, Beijing, CN;
Pengcheng Wang, Beijing, CN;
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD., Hefei, Anhui, CN;
Abstract
Embodiments of the present invention provide an attachment apparatus and an attachment method for a conductive adhesive. The attachment apparatus includes: a carrier stage, which is provided with at least one working surface, the working surface being configured to support a printed circuit board and provided with a groove, and the groove being provided with a plurality of adsorption holes on its bottom surface; a vacuum adsorption device being connected to each of the plurality of adsorption holes; and an attaching mechanism provided above the carrier stage, and configured to attach the conductive adhesive to a predetermined region of the printed circuit board, and the predetermined region being a region of the printed circuit board to be squeeze connected to a flexible printed circuit board or a chip on film.