Minghui Liu

Title: The Innovations of Minghui Liu

Introduction

Minghui Liu is a prominent inventor based in Beijing, China. He has made significant contributions to the field of technology, particularly in the development of innovative attachment apparatuses and bonding methods. With a total of 2 patents, Liu's work showcases his expertise and dedication to advancing technology.

Latest Patents

Minghui Liu's latest patents include an "Attachment apparatus and attachment method for conductive adhesive." This invention provides a sophisticated attachment apparatus that features a carrier stage with a working surface designed to support a printed circuit board. The apparatus includes a groove with multiple adsorption holes connected to a vacuum adsorption device, facilitating the precise application of conductive adhesive to specific regions of the printed circuit board.

Another notable patent is the "Bearing platform and COF repair bonder." This invention presents a bearing platform with an adjustable size, enhancing its practicality. The design reduces the volume and weight of the COF repair bonder, making it easier to transport and use. The platform consists of a fixed part and at least one movable extension, allowing for efficient support of display panels.

Career Highlights

Minghui Liu has worked with several esteemed companies, including BOE Technology Group Co., Ltd. and Hefei Xinsheng Optoelectronics Technology Co., Ltd. His experience in these organizations has contributed to his innovative mindset and technical skills.

Collaborations

Throughout his career, Liu has collaborated with notable colleagues such as Hanwei Tu and Hongjie Ding. These partnerships have fostered a creative environment that encourages the exchange of ideas and technological advancements.

Conclusion

Minghui Liu's contributions to technology through his patents and collaborations highlight his role as an influential inventor. His innovative solutions continue to impact the industry positively.