Hongin Jiang

Title: Innovations of Hongin Jiang in Controlled Solder Height Packages

Introduction

Hongin Jiang is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of electronics through his innovative patent related to solder height packages. His work is particularly relevant in the manufacturing and assembly processes of electronic components.

Latest Patents

Hongin Jiang holds a patent for "Controlled solder height packages and assembly processes." This invention involves an apparatus that includes a substrate with a surface and multiple bonding pads. The apparatus features a solder material positioned on the bonding pads, extending outward from them. Notably, the solder on the bonding pads varies in distance, with one pad extending a first distance and another extending a second distance, which is different from the first. This innovation enhances the precision and reliability of electronic assemblies.

Career Highlights

Hongin Jiang is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing. His role at Intel allows him to apply his inventive skills in a dynamic and innovative environment.

Collaborations

Hongin has collaborated with talented coworkers such as Arun Kumar C Nallani and Wei Tan. Their combined expertise contributes to the development of cutting-edge technologies in the electronics sector.

Conclusion

Hongin Jiang's contributions to controlled solder height packages exemplify the importance of innovation in the electronics industry. His patent not only showcases his inventive capabilities but also highlights the collaborative efforts within his team at Intel Corporation.