The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2018

Filed:

Sep. 29, 2012
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Hongin Jiang, Chandler, AZ (US);

Arun Kumar C. Nallani, Chandler, AZ (US);

Wei Tan, Chandler, AZ (US);

Assignee:

INTEL CORPORATION, Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/48 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 21/4853 (2013.01); H01L 23/48 (2013.01); H01L 23/49816 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14051 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3511 (2013.01);
Abstract

An apparatus comprises a substrate including a surface and a plurality of bonding pads positioned on the surface. The apparatus also includes a material comprising a solder positioned on the bonding pads and extending a distance outward therefrom. A first of the bonding pads in a first location on the substrate surface includes the solder extending a first distance outward therefrom. A second of the bonding pads in a second location on the substrate surface includes the solder extending a second distance outward therefrom. The first distance is different than the second distance. Other embodiments are described and claimed.


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