Hangzhou, China

Honghui Liu

This inventor holds 2 USPTO granted patents and 1 EPO patent. Top assignee: Huawei Technologies Co., Limited. Active years: 2019-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Honghui Liu. Retrieved from https://idiyas.com/inventor/honghui-liu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0


Average Co-Inventor Count = 3.4

ph-index = 1


Company Filing History:


Years Active: 2019-2021

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2 patents (USPTO):Explore Patents

Title: **Innovator Honghui Liu: A Pioneer in Interconnection Systems and Heat Dissipation Technologies**

Introduction

Honghui Liu, located in Hangzhou, China, is a prominent inventor with a unique contribution to the field of technology through his innovative patents. With a total of two patents to his name, Liu has made significant strides in interconnection systems and thermal management technologies.

Latest Patents

Liu's latest patents include an "Interconnection System" and an "Interconnection Control Method and Apparatus." This system features a first gating unit comprising two terminals; one connects directly to the first CPU, which remains indirectly connected under specific conditions. Additionally, the second gating unit is designed similarly, connecting to a second CPU. This innovative setup allows for efficient CPU interconnection when both gating units are activated. Furthermore, his patent on a "Heat-Pipe Heat Dissipation System and Power Device" outlines a sophisticated cooling solution, involving multiple pipelines with evaporation sections and quick connectors, aimed at enhancing thermal efficiency and performance.

Career Highlights

Currently, Honghui Liu is associated with Huawei Technologies Co., Limited, a leading global technology company. His work at Huawei exemplifies his commitment to advancing telecommunications and innovative systems, contributing to the company’s reputation for cutting-edge technology.

Collaborations

In his professional journey, Liu has collaborated with talented colleagues such as Defu Liao and Fei Zhang. Their collective expertise has fostered an environment of innovation, enabling breakthroughs in their respective projects and patents.

Conclusion

Honghui Liu stands as a testament to the spirit of innovation within the technology sector. His contributions, particularly in interconnection systems and thermal management solutions, not only highlight his inventive capabilities but also reflect the collaborative efforts of professionals within Huawei Technologies. Liu's patents represent essential advancements that continue to shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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