The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2019

Filed:

Mar. 24, 2017
Applicant:

Huawei Technologies Co., Ltd., Shenzhen, CN;

Inventors:

Yaofeng Peng, Hangzhou, CN;

Zhijian Li, Shenzhen, CN;

Honghui Liu, Hangzhou, CN;

Shanjiu Chi, Shenzhen, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28D 15/02 (2006.01); F28D 15/04 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20681 (2013.01); F28D 15/0266 (2013.01); F28D 15/04 (2013.01); H05K 7/20327 (2013.01); H05K 7/20336 (2013.01); H05K 7/20381 (2013.01); H05K 7/20672 (2013.01); H05K 7/20809 (2013.01);
Abstract

A system, including a first pipeline and a second pipeline, where the first pipeline includes a first steam pipe, a first liquid pipe, and an evaporation section connected between the first steam pipe and the first liquid pipe, and the second pipeline includes a second steam pipe, a second liquid pipe, and a heat exchanger connected between the second steam pipe and the second liquid pipe. Two pairs of quick connectors are respectively connected between the first steam pipe and the second steam pipe and between the first liquid pipe and the second liquid pipe. The loop heat pipe includes a valve and a nozzle that are configured for vacuum pumping. Refrigerant is provided inside the loop heat pipe. A capillary structure is provided inside the evaporation section to provide a capillary suction force to enable the refrigerant to circulate in the loop heat pipe.


Find Patent Forward Citations

Loading…