Jilin, China

Hongbing Cheng

This inventor holds 1 USPTO granted patent. Top assignee: Jilin University. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hongbing Cheng. Retrieved from https://idiyas.com/inventor/hongbing-cheng-6cetkuvx

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 20.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Innovations in Micromechanical Testing: The Contributions of Hongbing Cheng

Introduction

Hongbing Cheng is a notable inventor based in Jilin, China, recognized for his significant contributions to the field of material testing. With a focus on developing advanced testing equipment, he aims to enhance our understanding of micromechanical properties under various conditions.

Latest Patents

Cheng holds a patent for his innovative "In-situ Testing Equipment for Testing Micromechanical Properties of Material in Multi-load and Multi-physical Field Coupled Condition." This advanced equipment comprises several modules including a frame supporting module, a tension/compression-low cycle fatigue module, a torsioning module, a three-point bending module, an impressing module, a thermal field and magnetic field application module, an in-situ observation module, and a clamp body module. The equipment is capable of applying five different types of loads: tension/compression, low cycle fatigue, torsion, bending, and impressing. This invention allows for an intensive study of the micromechanical properties of materials while considering multiple physical fields, thereby providing insights into deformation behavior, mechanisms of damage, performance weakening, and other material properties.

Career Highlights

Cheng has established his career at Jilin University, where his research focuses on the interface of materials science and engineering. His deep-seated interest in micromechanical testing positions him as a leader in the field, advocating for the importance of understanding material behavior under complex loading conditions.

Collaborations

Working alongside talented coworkers Hongwei Zhao and Luquan Ren, Cheng has fostered a collaborative environment that encourages innovation and research excellence. Their combined efforts enhance the potential for breakthroughs in the study of micromechanical properties.

Conclusion

With his pioneering patent and dedicated career at Jilin University, Hongbing Cheng continues to drive advancements in the testing of material properties. His work not only contributes to scientific knowledge but also promises to influence future innovations in materials engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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