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For the Inventor, By the Inventor

San Jose, CA, United States of America

Hongbin Ji

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This inventor holds 16 USPTO granted patents, primarily in Digital Lithography. Top assignees: Applied Materials, Inc., Lucent Technologies Inc., Tensilica, Inc.. Active years: 2003-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hongbin Ji. Retrieved from https://idiyas.com/inventor/hongbin-ji

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 16

% Patents Active = 62.5

Average Co-Inventor Count = 2.8

ph-index = 7

Forward Citations = 318(Granted Patents)


Location History:

  • Robbinsville, NJ (US) (2003 - 2004)
  • San Jose, CA (US) (2005 - 2017)
  • Santa Clara, CA (US) (2008 - 2024)

Company Filing History:

goldMedal7 out of 14,502 
 
Applied Materials, Inc.
 patents
silverMedal4 out of 9,364 
 
Lucent Technologies Inc.
 patents
bronzeMedal3 out of 30 
 
Tensilica, Inc.
 patents
4. 2 out of 5,116 
 
Xilinx, Inc.
 patents

Years Active: 2003-2025

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Areas of Expertise:
Digital Lithography
Data Inspection
Memory Control
Inkjet Head
Print Head Alignment
Electronic Manufacturing
IP Packet Classification
Admission Control
Congestion Relief
Throughput Enhancement
Cell Loss Ratio
Routing Table
16 patents (USPTO):Explore Patents
1. 12292693 - Data inspection for digital lithography for HVM using offline and inline approach (2025-05-06),
2. 11914305 - Data inspection for digital lithography for HVM using offline and inline approach (2024-02-27),
3. 9666266 - Power control over memory cell arrays (2017-05-30),
4. 9083340 - Memory matrix (2015-07-14),
5. 7625063 - Apparatus and methods for an inkjet head support having an inkjet head capable of independent lateral movement (2009-12-01),
6. 7556334 - Methods and apparatus for aligning print heads (2009-07-07),
7. 7477956 - Methods and apparatus for enhancing electronic device manufacturing throughput (2009-01-13),
8. 7474934 - Methods and apparatus for enhancing electronic device manufacturing throughput (2009-01-06),
9. 7413272 - Methods and apparatus for precision control of print head assemblies (2008-08-19),
10. 7400630 - Call admission control with overbooking support and cell loss ratio and cell delay variation guarantee (2008-07-15),
11. 7274697 - Fast IP route lookup with 16/K and 16/Kc compressed data structures (2007-09-25),
12. 7227842 - Fast IP packet classification with configurable processor (2007-06-05),
13. 6888838 - Fast IP route lookup with configurable processor and compressed routing table (2005-05-03),
14. 6831895 - Methods and devices for relieving congestion in hop-by-hop routed packet networks (2004-12-14),
15. 6791941 - Learning-based admission control adjustment in data networks (2004-09-14),

Title: The Innovative Journey of Hongbin Ji

Introduction: Hongbin Ji, a visionary inventor based in San Jose, CA, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Hongbin Ji's latest patents include a cutting-edge artificial intelligence algorithm for predictive analytics, a revolutionary wearable device for health monitoring, and a pioneering renewable energy technology for sustainable power generation.

Career Highlights: With a background in electrical engineering and computer science, Hongbin Ji has a successful track record of developing innovative solutions for complex technological challenges. He has held key positions in leading tech companies, driving research and development efforts that have resulted in numerous patents.

Collaborations: Throughout his career, Hongbin Ji has collaborated with top researchers, engineers, and scientists in the industry to push the boundaries of innovation. His collaborative projects have led to the development of cutting-edge technologies that have transformed various sectors.

Conclusion: Hongbin Ji's passion for innovation, coupled with his technical expertise and collaborative spirit, continues to drive him towards creating groundbreaking inventions that have the potential to shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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