Tianjin, China

Hong-Yun He


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: Innovations of Hong-Yun He in Semiconductor Technology

Introduction

Hong-Yun He is a notable inventor based in Tianjin, China. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique apparatus and method for connecting semiconductor devices in a single electronics package.

Latest Patents

Hong-Yun He holds a patent for an "Apparatus and method for series connection of two die or chips in a single electronics package." This invention describes a method for connecting two semiconductor devices in electrical series. The first device is mounted P-side down on an electrically conductive substrate, while the second device is mounted P-side up at a spaced location on the substrate. This design allows for efficient electrical connections and enhances the functionality of semiconductor packages.

Career Highlights

He is currently employed at Vishay General Semiconductor, Inc., where he continues to innovate in the semiconductor industry. His work focuses on improving the design and manufacturing processes of semiconductor devices. With a patent count of 1 patent, he has established himself as a valuable contributor to his field.

Collaborations

Hong-Yun He has collaborated with notable colleagues such as Ta-Te Chou and Hui-Ying Ding. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Hong-Yun He is a prominent figure in semiconductor technology, with a focus on innovative packaging methods for semiconductor devices. His contributions have the potential to impact the efficiency and performance of electronic systems.

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