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For the Inventor, By the Inventor

Shanghai, China

Hong Yang

This inventor holds 18 USPTO granted patents and 24 published patent applications and 13 EPO patents, primarily in Photovoltaic Encapsulation. Top assignees: Dow Global Technolgoies LLC, Dow Silicones Corporation, University of Michigan. Active years: 2006-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hong Yang. Retrieved from https://idiyas.com/inventor/hong-yang-zpmqghw4

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 18 

% Patents Active = 88.9

 

Average Co-Inventor Count = 5.3

ph-index = 1

Forward Citations = 7(Granted Patents)


Location History:

  • Ann Arbor, MI (US) (2006)
  • Shanghai, CN (2014 - 2024)

Company Filing History:

goldMedal18 out of 4,810 
 
Dow Global Technolgoies LLC
 patents
silverMedal1 out of 490 
 
Dow Silicones Corporation
 patents
bronzeMedal1 out of 3,546 
 
University of Michigan
 patents
where one patent can have more than one assignee

Years Active: 2006-2026

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Areas of Expertise:
Photovoltaic
Encapsulant Films
Polyolefin Compositions
Heat Resistant Seal Film
Hydrophobic Silica
Adhesive Formulations
Ethylene-Based Polymers
Curable Compositions
Fumed Alumina
Triallyl Phosphate
Olefin Polymerization
Paint Composition
18 patents (USPTO):Explore Patents
1. 12654909 - Heat resistant thermal seal film (2026-06-16),
2. 12507488 - PV module with film layer comprising hydrophobic-treated fumed silica (2025-12-23),
3. 12460066 - Ethylene/alpha-olefin interpolymer compositions with high glass adhesion (2025-11-04),
4. 12428507 - Polyolefin compositions for photovoltaic encapsulant films (2025-09-30),
5. 12410304 - PV module with film layer comprising hydrophilic fumed silica (2025-09-09),
6. 12281186 - Ethylene/alpha-olefin interpolymer based compositions with improved balance of cure and processability (2025-04-21),
7. 12234343 - Photovoltaic encapsulant films comprising fumed alumina (2025-02-25),
8. 12138828 - Hollow pellets and methods of soaking (2024-11-12),
9. 12129368 - Curable compositions comprising unsaturated polyolefins (2024-10-29),
10. 12077643 - Non-polar ethylene-based compositions with triallyl phosphate for encapsulant films (2024-09-03),
11. 11613634 - Non-polar ethylene-based polymer compositions for encapsulant films (2023-03-28),
12. 11485839 - Polyolefin compositions for photovoltaic encapsulant films (2022-11-01),
13. 11485831 - Primerless paint composition, methods of manufacture thereof and articles comprising the same (2022-11-01),
14. 11193010 - Polyolefin compositions for photovoltaic encapsulant films (2021-12-07),
15. 10752770 - Adhesive formulations for fabric/POE adhesion (2020-08-25),

Title: The Innovative Journey of Inventor Hong Yang

Introduction: Hong Yang, a pioneering inventor hailing from Shanghai, CN, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Hong Yang's latest patents include a cutting-edge artificial intelligence algorithm for autonomous vehicles, a revolutionary medical device for non-invasive surgery, and a sustainable energy solution for renewable power generation.

Career Highlights: Throughout his illustrious career, Hong Yang has been recognized for his innovative spirit and dedication to pushing the boundaries of technology. He has received multiple awards for his inventions, including the prestigious Inventor of the Year accolade.

Collaborations: Hong Yang has collaborated with leading research institutions, universities, and tech companies to further develop and commercialize his inventions. His partnerships have led to the successful implementation of his technologies in various industries.

Conclusion: In conclusion, Hong Yang's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a trailblazing inventor in the realm of technology. His contributions continue to inspire future generations of inventors to think outside the box and create solutions that shape the world of tomorrow.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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