The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2025
Filed:
Oct. 31, 2017
Applicant:
Dow Global Technologies Llc, Midland, MI (US);
Inventors:
Yunfeng Yang, Shanghai, CN;
Chao He, Shanghai, CN;
Weiming Ma, Shanghai, CN;
Hongyu Chen, Shanghai, CN;
Yabin Sun, Shanghai, CN;
Kainan Zhang, Shanghai, CN;
Jeffrey M. Cogen, Flemington, NJ (US);
Timothy J. Person, Pottstown, PA (US);
Yuyan Li, Shanghai, CN;
Hong Yang, Shanghai, CN;
Assignee:
Dow Global Technologies LLC, Midland, MI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 5/5425 (2006.01); C08F 10/02 (2006.01); C08F 110/02 (2006.01); C08J 3/28 (2006.01); C08K 5/14 (2006.01); C08K 5/549 (2006.01); C08L 23/26 (2006.01); C09D 5/00 (2006.01); C09D 7/63 (2018.01); C09D 123/26 (2006.01); H01B 3/44 (2006.01); H01B 13/00 (2006.01); H01L 31/048 (2014.01); H10F 19/80 (2025.01); C08L 23/04 (2006.01); C08L 23/06 (2006.01); H01B 7/282 (2006.01); H01B 7/295 (2006.01);
U.S. Cl.
CPC ...
C08F 110/02 (2013.01); C08F 10/02 (2013.01); C08J 3/28 (2013.01); C08K 5/14 (2013.01); C08K 5/5425 (2013.01); C08K 5/549 (2013.01); C08L 23/26 (2013.01); C09D 5/00 (2013.01); C09D 7/63 (2018.01); C09D 123/26 (2013.01); H01B 3/441 (2013.01); H01B 13/0016 (2013.01); H10F 19/804 (2025.01); C08F 2810/20 (2013.01); C08J 2323/06 (2013.01); C08L 23/04 (2013.01); C08L 23/06 (2013.01); C08L 2023/44 (2013.01); C08L 2205/025 (2013.01); C08L 2207/066 (2013.01); C08L 2312/08 (2013.01); H01B 7/282 (2013.01); H01B 7/295 (2013.01);
Abstract
The present disclosure relates to an encapsulant film made from a curable composition comprising: (A) a polyolefin polymer; (B) an organic peroxide; (C) a silane coupling agent; and (D) a co-agent comprising a monocyclic organosiloxane of formula (I).