Company Filing History:
Years Active: 2024
Title: Innovations of Hong Wen in Chip-on-Film Packaging Technology
Introduction: Hong Wen is a notable inventor based in Wuhan, China. He has made significant contributions to the field of semiconductor packaging technology. His innovative work focuses on enhancing the efficiency and effectiveness of chip-on-film (COF) packaging structures.
Latest Patents: Hong Wen holds a patent for a chip-on-film packaging structure and method. This invention provides a unique COF packaging structure that includes a flexible substrate and a chip. The flexible substrate features a first groove on its surface, along with a protrusion and a substrate bonding pad. The chip is designed with a second groove and a corresponding chip bonding pad. This innovative design allows for the chip to be embedded securely within the flexible substrate, ensuring electrical connectivity between the chip bonding pad and the substrate bonding pad.
Career Highlights: Hong Wen is currently employed at Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. His work at this company has allowed him to further develop his expertise in semiconductor technologies. He has been instrumental in advancing COF packaging methods, which are crucial for modern electronic devices.
Collaborations: Hong Wen collaborates with Yicheng Chen, who is also involved in the semiconductor field. Their partnership has contributed to the development of innovative solutions in packaging technology.
Conclusion: Hong Wen's contributions to chip-on-film packaging technology demonstrate his commitment to innovation in the semiconductor industry. His patent reflects a significant advancement in the field, showcasing the potential for improved electronic device performance.