The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2024
Filed:
Sep. 03, 2020
Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Wuhan, CN;
Yicheng Chen, Wuhan, CN;
Hong Wen, Wuhan, CN;
Abstract
The present invention provides a chip-on-film (COF) packaging structure and a COF packaging method. The COF packaging structure includes a flexible substrate and a chip. The flexible substrate includes a first groove provided on a first surface of the flexible substrate, a protrusion provided in the first groove, and a substrate bonding pad disposed in the first groove. The chip includes a second groove provided on a second surface of the chip, and a chip bonding pad disposed on the second surface and corresponding to the substrate bonding pad. The first groove of the flexible substrate is matched with a peripheral shape of the chip, and the second groove is matched with the protrusion of the first groove to embed the chip in the flexible substrate. The chip bonding pad is electrically connected to the substrate bonding pad.