Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.

Hong Wen

Yicheng Chen

The present invention provides a chip-on-film (COF) packaging structure and a COF packaging method. The COF packaging structure includes a flexible substrate and a chip. The flexible substrate includes a first groove provided on a first surface of the flexible substrate, a protrusion provided in the first groove, and a substrate bonding pad disposed in the first groove. The chip includes a second groove provided on a second surface of the chip, and a chip bonding pad disposed on the second surface and corresponding to the substrate bonding pad. The first groove of the flexible substrate is matched with a peripheral shape of the chip, and the second groove is matched with the protrusion of the first groove to embed the chip in the flexible substrate. The chip bonding pad is electrically connected to the substrate bonding pad.

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Wuhan, China

Hong Wen