Hong-Wei Du

Title: Innovations of Hong-Wei Du in Heat Dissipation Technology

Introduction

Hong-Wei Du is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of heat dissipation technology. His innovative designs aim to improve the efficiency and effectiveness of heat management in various applications.

Latest Patents

One of Hong-Wei Du's key patents is a heat dissipation device featuring a heat pipe. This device includes a heat conducting base, a heat sink mounted on the base, and two heat pipes that thermally contact both the heat sink and the base. The heat sink is constructed from metal extrusion and incorporates a heat conducting cylinder at its periphery, along with multiple fins extending from and surrounding the cylinder. The cylinder consists of four interconnected sides, and the fins on the same side are parallel to each other. The two heat pipes thermally surround the cylinder of the heat sink, ensuring complete contact with the heat sink.

Career Highlights

Throughout his career, Hong-Wei Du has worked with prominent companies such as Fu Zhun Precision Industry Co., Ltd. and Foxconn Technology Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Hong-Wei Du has collaborated with talented individuals in the industry, including Hsieh-Kun Lee and Chun-Chi Chen. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Hong-Wei Du's contributions to heat dissipation technology exemplify his innovative spirit and dedication to improving efficiency in thermal management. His work continues to influence the industry and inspire future advancements.