The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2007
Filed:
Oct. 06, 2005
Hsieh-kun Lee, Tu-Cheng, TW;
Chun-chi Chen, Tu-Cheng, TW;
Shi-wen Zhou, Shenzhen, CN;
Zhan Wu, Shenzhen, CN;
Bing-wen Zhou, Shenzhen, CN;
Hong-wei Du, Shenzhen, CN;
Hsieh-Kun Lee, Tu-Cheng, TW;
Chun-Chi Chen, Tu-Cheng, TW;
Shi-Wen Zhou, Shenzhen, CN;
Zhan Wu, Shenzhen, CN;
Bing-Wen Zhou, Shenzhen, CN;
Hong-Wei Du, Shenzhen, CN;
Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Bao'an District, Shenzhen, Guangdong Province, CN;
Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;
Abstract
A heat dissipation device includes a heat conducting base, a heat sink on the base and two heat pipes thermally contacting with the heat sink and the base. The heat sink is made of metal extrusion and includes a heat conducting cylinder at a periphery of the heat sink and a plurality of fins extending from and surrounded by the cylinder. The cylinder includes four interconnected sides. The fins of the same side are parallel to each other. The two heat pipes thermally surround the cylinder of the heat sink and wholly contact the heat sink.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile