Hsinchu, Taiwan

Honda Pai

This inventor holds 1 USPTO granted patent. Top assignee: Vanguard International Semiconductor Corporation. Active years: 2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Honda Pai. Retrieved from https://idiyas.com/inventor/honda-pai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: Honda Pai - Innovator in CMP Technology

Introduction

Honda Pai is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, particularly in the area of chemical mechanical polishing (CMP). His innovative approach has led to the development of a patented method that addresses common challenges in the planarization process.

Latest Patents

Honda Pai holds a patent for a method to prevent CMP overpolish. This process is designed to avoid dishing in a planarizing layer whose final thickness is reduced by chemical mechanical polishing. The method involves coating the surface to be planarized with a layer of a hard dielectric material, such as silicon nitride, before depositing the planarizing medium. During the CMP process, the etch rate is continuously monitored. When the etch front approaches the hard layer, a decrease in the etch rate is detected, prompting the termination of etching to eliminate any dishing effects. This innovative solution enhances the efficiency and quality of semiconductor manufacturing.

Career Highlights

Honda Pai is currently employed at Vanguard International Semiconductor Corporation, where he applies his expertise in semiconductor technology. His work has been instrumental in advancing the company's capabilities in producing high-quality semiconductor devices. With a focus on innovation, he continues to contribute to the field through his research and development efforts.

Collaborations

Throughout his career, Honda Pai has collaborated with esteemed colleagues, including Rong-Wu Chien and Chia-Hui Wu. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and advancements in semiconductor technology.

Conclusion

Honda Pai's contributions to the field of semiconductor manufacturing, particularly through his patented method for preventing CMP overpolish, highlight his innovative spirit and dedication to advancing technology. His work at Vanguard International Semiconductor Corporation and collaborations with fellow experts further underscore his impact on the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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