Homer H Glascock, Ii

This inventor holds 30 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: General Electric Company, Harris Corporation. Active years: 1977-1996.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Homer H Glascock, Ii. Retrieved from https://idiyas.com/inventor/homer-h-glascock-ii

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 30

% Patents Active = 100.0

Average Co-Inventor Count = 2.7

ph-index = 16

Forward Citations = 723(Granted Patents)

Location History:

Schenectady, NY (US) (1986)
Scotia, NY (US) (1977 - 1994)
Millis, MA (US) (1995 - 1996)

Company Filing History:

27 out of 52,395

General Electric Company

Years Active: 1977-1996

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Areas of Expertise:

Semiconductor Device

Hermetic Package

Thermocompression Bonding

Power Semiconductor

Silicon Package

Multi-Chip Interconnection

Ultrasonic Testing

Cooled Module

Thin Electronic Chips

High Current Packaging

Temperature Compensation

Fluorescent Lamp

30 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 5577656 - Method of packaging a semiconductor device (1996-11-26),

2. 5473193 - Package for parallel subelement semiconductor devices (1995-12-05),

3. 5446316 - Hermetic package for a high power semiconductor device (1995-08-29),

4. 5304847 - Direct thermocompression bonding for thin electronic power chips (1994-04-19),

5. 5209390 - Hermetic package and packaged semiconductor chip having closely spaced (1993-05-11),

6. 5206186 - Method for forming semiconductor electrical contacts using metal foil (1993-04-27),

7. 5184206 - Direct thermocompression bonding for thin electronic power chips (1993-02-02),

8. 5166773 - Hermetic package and packaged semiconductor chip having closely spaced (1992-11-24),

9. 5135890 - Method of forming a hermetic package having a lead extending through an (1992-08-04),

10. 5133795 - Method of making a silicon package for a power semiconductor device (1992-07-28),

11. 5105536 - Method of packaging a semiconductor chip in a low inductance package (1992-04-21),

12. 5103290 - Hermetic package having a lead extending through an aperture in the (1992-04-07),

13. 5100740 - Direct bonded symmetric-metallic-laminate/substrate structures (1992-03-31),

14. 5034044 - Method of bonding a silicon package for a power semiconductor device (1991-07-23),

15. 5028987 - High current hermetic package having a lead extending through the (1991-07-02),

Title: Inventor Homer H Glascock, II

Introduction: Homer H Glascock, II is a renowned inventor based in Scotia, NY (US) known for his innovative contributions to various fields.

Latest Patents: Homer H Glascock, II holds several patents in his name, showcasing his continuous dedication to creating new solutions and technologies.

Career Highlights: Throughout his career, Homer H Glascock, II has demonstrated a keen ability to identify gaps in the market and develop groundbreaking inventions to address them. His work has significantly impacted industries such as technology, healthcare, and consumer goods.

Collaborations: Homer H Glascock, II has collaborated with leading companies, research institutions, and universities to further enhance his inventions and bring them to the market. His partnerships have been instrumental in the success of his innovative projects.

Conclusion: Homer H Glascock, II's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a pioneering inventor in Scotia, NY (US) and beyond.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]