Holger Wörner

Title: Holger Wörner: Innovator in Semiconductor Technology

Introduction

Holger Wörner is a prominent inventor based in Wuppertal, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on innovative methods for producing electronic components that enhance performance and efficiency.

Latest Patents

Wörner's latest patents include a method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds. This invention involves embedding semiconductor chips in a first plastic layer, surrounded by a bead, while a second plastic layer compensates for any unevenness. Another notable patent is for an electronic package that features an integrated cooling element. This design includes a semiconductor chip attached to a wiring board, which is completely enclosed by a package that incorporates a cooling element as an integral part.

Career Highlights

Holger Wörner is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His work at Infineon has allowed him to push the boundaries of electronic component design and functionality.

Collaborations

Wörner has collaborated with notable colleagues such as Bernd Goller and Robert-Christian Hagen. These partnerships have contributed to the advancement of innovative technologies in the semiconductor industry.

Conclusion

Holger Wörner's contributions to semiconductor technology through his patents and work at Infineon Technologies AG highlight his role as a key innovator in the field. His inventions continue to influence the development of electronic components, showcasing the importance of innovation in technology.