Infineon Technologies Ag

Holger Wörner

Michael Bauer

Gerald Ofner

Bernd Goller

Robert-Christian Hagen

Stefan Wein

Christian Stuempfl

Bernd Waidhas

Thomas Bemmerl

Rainer Steiner

Josef Thumbs

Christian Stümpfl

An electronic component and a blank have plastic embedding compounds of a first and a second plastic layer. Semiconductor chips are embedded in the first plastic layer in such a way that their marginal sides are surrounded by a bead. The second plastic layer compensates for the unevenness of a upper boundary of the first plastic layer.

Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds

An electronic component includes at least one semiconductor chip. The semiconductor chip is attached on a first side of a wiring board or a leadframe. The wiring board is provided with interconnect structures at least on a second side. The first side of the wiring board, with the semiconductor chip located on it, is completely enclosed by a package. The package is provided with a cooling element, which is an integral part of the package. The invention also relates to a method for producing the electronic component.

Electronic package having integrated cooling element with clearance for engaging package

The invention relates to an electronic component having at least one semiconductor chip and a flat chip carrier assigned to the semiconductor chip. Electrical connections between contact areas on an active chip surface of the semiconductor chip and contact terminal areas on an upper side of the chip carrier are formed by strips of material that can undergo microstructuring and that are provided with an electrically conductive coating. The invention also relates to a method for producing the electronic component.

Electronic component with at least one semiconductor chip and method for its manufacture

An electronic component has a semiconductor chip with chip contacts. The chip contacts are mechanically fixed on a wiring structure and electrically connected to the wiring structure. The wiring structure is formed as a region of a structured metal plate or as a region of a structured metal layer of a metal-clad base plate. Ideally, a panel having a number of component positions is provided for receiving a number of such an electronic component.

Universal package for an electronic component with a semiconductor chip and method for producing the universal package

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Wuppertal, Germany

Holger Wörner