The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7517722 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 14, 2009

Filed:

Jul. 24, 2006
Applicants:

Bernd Goller, Otterfing, DE;

Robert-christian Hagen, Sarching, DE;

Gerald Ofner, Bad Abbach, DE;

Christian Stuempfl, Schwandorf, DE;

Stefan Wein, Regensburg, DE;

Holger Wörner, Regensburg, DE;

Inventors:

Bernd Goller, Otterfing, DE;

Robert-Christian Hagen, Sarching, DE;

Gerald Ofner, Bad Abbach, DE;

Christian Stuempfl, Schwandorf, DE;

Stefan Wein, Regensburg, DE;

Holger Wörner, Regensburg, DE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic component and a blank have plastic embedding compounds of a first and a second plastic layer. Semiconductor chips are embedded in the first plastic layer in such a way that their marginal sides are surrounded by a bead. The second plastic layer compensates for the unevenness of a upper boundary of the first plastic layer.


Find Patent Forward Citations

Goller, Bernd. (2009). Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds (U.S. Patent No. 7517722). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7517722

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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