Nordborg, Denmark

Holger Ulrich

This inventor holds 1 USPTO granted patent and 1 published patent application and 2 EPO patents. Top assignee: Danfoss Silicon Power Gmbh. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Holger Ulrich. Retrieved from https://idiyas.com/inventor/holger-ulrich-sa2bdpbz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

 

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Holger Ulrich: Innovator in Power Module Technology

Introduction

Holger Ulrich is a notable inventor based in Nordborg, Denmark. He has made significant contributions to the field of power module technology, holding one patent that showcases his innovative approach to electrical engineering.

Latest Patents

Holger Ulrich's most recent patent is a power module that includes a rigid insulated substrate mounted on a baseplate. An additional circuit carrier is also mounted on the baseplate, positioned adjacent to the rigid insulated substrate. This additional circuit carrier possesses a rigidity that is less than that of the rigid insulated substrate, highlighting a unique design that enhances the functionality of power modules.

Career Highlights

Throughout his career, Holger has worked with prominent companies in the industry, including Danfoss Silicon Power GmbH and Heraeus Deutschland GmbH & Co. KG. His experience in these organizations has allowed him to develop and refine his expertise in power module technology.

Collaborations

Holger has collaborated with several talented individuals in his field, including Ole Mühlfeld and Klaus Olesen. These partnerships have contributed to the advancement of his projects and innovations.

Conclusion

Holger Ulrich's work in power module technology exemplifies his commitment to innovation and engineering excellence. His contributions continue to influence the industry and inspire future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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