Company Filing History:
Years Active: 2013-2015
Title: Holger Ostmann: Innovator in Power Semiconductor Technology
Introduction
Holger Ostmann is a notable inventor based in Rodgau, Germany. He has made significant contributions to the field of power semiconductor technology, holding a total of 3 patents. His work focuses on enhancing the efficiency and reliability of semiconductor devices.
Latest Patents
One of Holger Ostmann's latest patents is an electrically isolated power semiconductor package with an optimized layout. This innovative device provides voltage isolation between a metal backside and the terminals of the semiconductor device. The design includes an encapsulant that defines a hole for receiving a structure to physically couple the device to an object. A direct-bonded copper (DBC) substrate is utilized to ensure electrical isolation and improve thermal transfer from the device to a heatsink. The first metal layer of the DBC substrate effectively spreads heat generated by the semiconductor die. This packaged power semiconductor device conforms to a TO-247 outline and is capable of receiving a screw for secure physical coupling to a heatsink.
Career Highlights
Holger Ostmann is currently employed at Ixys Corporation, where he continues to develop cutting-edge semiconductor technologies. His expertise in the field has positioned him as a key player in advancing power semiconductor solutions.
Collaborations
Throughout his career, Holger has collaborated with notable colleagues, including Thomas Spann and Kang Rim Choi. These partnerships have contributed to the successful development of innovative semiconductor technologies.
Conclusion
Holger Ostmann's contributions to power semiconductor technology demonstrate his commitment to innovation and excellence in the field. His patents reflect a deep understanding of the challenges in semiconductor design and a dedication to improving device performance.