This inventor holds 1 USPTO granted patent. Top assignee: H-Technologies Group, Incorporated. Active years: 1999.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1999
Title: Holger J Koenigsmann: Innovator in Lead-Free Solder Materials
Introduction
Holger J Koenigsmann is a notable inventor based in Oakwood, OH (US). He has made significant contributions to the field of materials science, particularly in the development of lead-free solder compositions. His innovative work addresses the growing need for environmentally friendly alternatives in electronic manufacturing.
Latest Patents
Holger J Koenigsmann holds a patent for high strength lead-free solder materials. This patent includes lead-free solder compositions consisting of at least 75.0 weight percent Sn, with varying percentages of Cu, In, and optional elements such as Zn, Se, Te, Ga, Sb, and Al. The compositions are designed to enhance the performance and reliability of solder joints in electronic devices.
Career Highlights
Koenigsmann is associated with H-Technologies Group, Incorporated, where he applies his expertise in materials science. His work has been instrumental in advancing the development of solder materials that meet industry standards while being environmentally sustainable.
Collaborations
He collaborates with Jennie S Hwang, a fellow innovator in the field. Their combined efforts contribute to the ongoing research and development of advanced materials for electronic applications.
Conclusion
Holger J Koenigsmann's contributions to lead-free solder materials exemplify the importance of innovation in materials science. His work not only addresses environmental concerns but also enhances the reliability of electronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile