The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 1999
Filed:
Dec. 12, 1996
Jennie S Hwang, Moreland Hills, OH (US);
Holger J Koenigsmann, Oakwood, OH (US);
H-Technologies Group, Incorporated, Cleveland, OH (US);
Abstract
Lead-free solder compositions consisting of at least 75.0 weight percent Sn, between 0.01 and 9.5 weight percent Cu, between about 0.1 and 10.0 weight percent In, and optionally including one or more of the following elements: Zn in an amount of not greater than 9.0 weight percent, Se or Te in an amount of not greater than 5.0 weight percent, Ga in an amount of not greater than 5.0 weight percent, Sb in an amount of not greater than 1.0 weight percent, Al in an amount of not greater than 1.0 weight percent. Lead-free solder compositions consisting of at least 75.0 weight percent Sn, between 0.5 and 6.5 weight percent Ag, between 0.5 and 8.0 weight percent Bi, and optionally including one or more of the following elements: between 0.1 and 10.0 weight percent In, Se or Te in an amount of not greater than 5.0 weight percent, Ga in an amount of not greater than 5.0 weight percent. Lead-free solder compositions consisting of at least 75.0 weight percent Sn, between 0.1 and 0.8 weight percent Ag, between 0.1 and 10.0 weight percent In, and optionally including one or more of the following elements: Zn in an amount of not greater than 9.0 weight percent, Se or Te in an amount of not greater than 1.0 weight percent, Ga in an amount of not greater than 1.0 weight percent, Sb in an amount of not greater than 1.0 weight percent, Al in an amount of not greater than 1.0 weight percent.