This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Asmpt Singapore Pte. Ltd.. Active years: 2023-2026.
Company Filing History:
Years Active: 2023-2026
Title: Hoi Ting Lam - Innovator in Ultrasonic Wire Bonding Technology
Introduction
Hoi Ting Lam is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of ultrasonic wire bonding technology. His innovative approach has led to the development of a unique force sensor that enhances the efficiency and accuracy of wire bonding operations.
Latest Patents
Hoi Ting Lam holds a patent for a "Force sensor in an ultrasonic wire bonding device." This invention features a piezoelectric sensing element that is mounted in an ultrasonic transducer. The sensor is designed to determine the bonding force during wire bonding operations. It includes a first portion and a second portion, each with opposing surfaces that contain electrodes. This innovative design allows for precise measurement of bonding forces, which is crucial in ensuring the quality of wire bonding processes.
Career Highlights
Hoi Ting Lam is currently employed at Asmpt Singapore Pte. Ltd., where he continues to work on advancements in ultrasonic technology. His expertise in this area has positioned him as a valuable asset to his company and the industry at large.
Collaborations
Hoi Ting Lam collaborates with talented individuals such as Hing Leung Li and Tsz Kit Yu. Their combined efforts contribute to the ongoing development of innovative solutions in the field of ultrasonic wire bonding.
Conclusion
Hoi Ting Lam's contributions to ultrasonic wire bonding technology exemplify the impact of innovation in engineering. His patent and ongoing work at Asmpt Singapore Pte. Ltd. highlight his commitment to advancing this critical technology.