Company Filing History:
Years Active: 2020-2024
Title: Hohyun Keum: Innovator in Bonded Assemblies and Quantum Dot Technologies
Introduction
Hohyun Keum is a prominent inventor based in Champaign, IL (US). He has made significant contributions to the fields of bonded assemblies and quantum dot technologies. With a total of 5 patents to his name, Keum's work is at the forefront of innovation in these areas.
Latest Patents
Hohyun Keum's latest patents include methods for creating a bonded polymeric assembly and a re-entrant structure. One of his notable inventions is a method of making a bonded polymeric assembly by transfer printing. This method involves contacting a stamp with a solid-phase ink that comprises a photoresist. The inked stamp is aligned with an object and stamped onto it, allowing for the transfer of the solid-phase ink. The result is a bonded polymeric assembly that features a strong joint between the solid-phase ink and the object. Another significant patent focuses on photoresist contact patterning of quantum dot films. This method describes how to create a patterned quantum dot layer by using a patterning stamp that adheres to a layer of quantum dots on a substrate.
Career Highlights
Hohyun Keum is affiliated with the University of Illinois, where he conducts his research and development work. His innovative approaches have garnered attention in the academic and industrial sectors alike.
Collaborations
Some of his notable coworkers include Seok Kim and Jun Kyu Park, who have collaborated with him on various projects.
Conclusion
Hohyun Keum's contributions to the fields of bonded assemblies and quantum dot technologies highlight his role as a leading inventor. His innovative methods and collaborative efforts continue to push the boundaries of technology and research.