The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2020

Filed:

Jun. 29, 2018
Applicant:

The Board of Trustees of the University of Illinois, Urbana, IL (US);

Inventors:

Seok Kim, Champaign, IL (US);

Zining Yang, Urbana, IL (US);

Hohyun Keum, Champaign, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/033 (2006.01); B41K 3/54 (2006.01); H01L 21/311 (2006.01); H01L 21/3065 (2006.01); B41K 3/24 (2006.01); B41K 3/56 (2006.01); B41K 3/04 (2006.01); C09D 11/103 (2014.01); B41K 3/62 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0337 (2013.01); B41K 3/04 (2013.01); B41K 3/24 (2013.01); B41K 3/54 (2013.01); B41K 3/56 (2013.01); B41K 3/62 (2013.01); C09D 11/103 (2013.01); H01L 21/3065 (2013.01); H01L 21/31144 (2013.01);
Abstract

A method for microassembly of heterogeneous materials comprises contacting a stamp with an ink disposed on a donor substrate to form an inked stamp, where the ink is reversibly bound to the stamp. The inked stamp is stamped onto a receiving substrate or onto an object on the receiving substrate, and the stamp is removed, thereby transferring the ink to the receiving substrate. The ink and the receiving substrate or the ink and the object are thermally joined, thereby forming a microassembly of heterogeneous materials. The ink may comprise a first material and the receiving substrate or the object may comprise a second material different from the first material.


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